Headphones with acoustically split cushions
AssigneeApple Inc.
InventorsMiikka O. Tikander, Yacine Azmi, Derek W. Wright
Life of this patent
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Abstract
Headphones are disclosed that include a first earcup assembly and a second earcup assembly. The headphones include a headband extending between the first and second earcup assemblies. The headband includes opposing ends attached to the first and second earcup assemblies, respectively. The first earcup assembly includes a first cushion coupled to an earcup. The first cushion includes a first portion that is acoustically open. The first cushion also includes a second portion acoustically sealed from the first portion.
Claims20
A headphone, comprising:
- a first earcup assembly including a first acoustically split cushion coupled to a first earcup, the first acoustically split cushion including a first portion comprising porous foam that is acoustically open and a second portion comprising closed foam that is acoustically sealed from the first portion;
- a second earcup assembly;
- and
- a headband extending between the first and second earcup assemblies, the headband including first and second opposing ends attached to the first and second earcup assemblies, respectively.
An acoustically split over-ear headphone earcup cushion, comprising:
- a first portion of the earcup cushion comprising porous foam that is acoustically open;
- and
- a second portion of the earcup cushion comprising closed foam that is acoustically sealed from the first portion;
- wherein the ear cup cushion is sized and shaped to fit over and around a user's ear.
Dependencies are inferred from the claim text.