Gradient micro-electro-mechanical systems (MEMS) microphone

A micro-electro-mechanical systems (MEMS) microphone assembly comprising:

• an enclosure;
• a micro-electro-mechanical systems (MEMS) transducer positioned within the enclosure;
• and
• a plurality of substrate layers including a first substrate layer and a second substrate layer to support the MEMS transducer,
• wherein the first substrate layer is configured to electrically couple the MEMS transducer to an end user circuit board;
• wherein the plurality of substrate layers define at least one transmission mechanism that is acoustically coupled to the MEMS transducer to enable an audio input signal to pass to the MEMS transducer,
• wherein the first transmission mechanism and the second transmission mechanism are positioned below the MEMS transducer,
• wherein the second substrate layer defines a first sound aperture and a second sound aperture extending through the second substrate layer,
• wherein a delay distance separates the first sound aperture from the second sound aperture,
• wherein the delay distance is longer than an overall length of the enclosure, and
• wherein the first substrate layer includes a flexible portion to form an angle of at least ninety degrees for enabling the microphone assembly to be surface mount coupled to the end user circuit board and wherein the microphone assembly is a standalone package.

A micro-electro-mechanical systems (MEMS) microphone assembly comprising:

• a first enclosure;
• a first micro-electro-mechanical systems (MEMS) transducer positioned within the first enclosure;
• a second enclosure;
• a second MEMS transducer positioned within the second enclosure;
• and
• a plurality of substrate layers including a first substrate layer and a second substrate layer to support the first MEMS transducer and the second MEMS transducer,
• wherein the plurality of substrate layers define a first transmission mechanism to enable the first MEMS transducer to receive an audio input signal and a second transmission mechanism to enable the second MEMS transducer to receive the audio input signal,
• wherein the first transmission mechanism and the second transmission mechanism are positioned below the MEMS transducer;
• wherein the plurality of substrate layers define a first sound aperture and a second sound aperture that are separated from one another by a delay distance, and
• wherein the delay distance is longer than an overall length of the first enclosure and the second enclosure.