Interference suppression apparatus, electronic subassembly, and use of an interference suppression apparatus

An interference suppression apparatus (100) for an electronic subassembly having a positive high-voltage pole (108) and a negative high-voltage pole (109), the interference suppression apparatus comprising

• at least one capacitance module (101;
• 101′, 101″), with in each case
• at least one first capacitor (103) via which the positive high-voltage pole (108) is connected to ground,
• at least one second capacitor (104) via which the negative high-voltage pole (109) is connected to ground, and
• at least one third capacitor (107) which is connected between the positive high-voltage pole (108) and the negative high-voltage pole (109);
• wherein the at least one capacitance module (101;
• 101′, 101″) comprises a capacitance module housing (601) for electromagnetic screening,
• wherein the capacitance module housing (601) houses the at least one first capacitor (103), the at least one second capacitor (104) and the at least one third capacitor (107),
• wherein the positive high-voltage pole (108) and the negative high-voltage pole (109) are arranged outside the capacitance module housing (601);
• and
• wherein an electrically insulating and thermally conductive layer (401) is formed on a face of the positive high-voltage pole (108) and of the negative high-voltage pole (109) facing away from the capacitance module housing (601).

An electronic subassembly (700;

• 800), having a positive high-voltage pole (108) and a negative high-voltage pole (109), and at least one interference suppression apparatus (100), the interference suppression apparatus (100) comprising
• at least one capacitance module (101;
• 101′, 101″), with in each case
• at least one first capacitor (103) via which the positive high-voltage pole (108) is connected to ground,
• at least one second capacitor (104) via which the negative high-voltage pole (109) is connected to ground, and
• at least one third capacitor (107) which is connected between the positive high-voltage pole (108) and the negative high-voltage pole (109);
• wherein the electronic subassembly comprises a housing (402);
• and wherein the positive high-voltage pole (108) is connected to ground via the at least one first capacitor (103) of the at least one capacitance module (101;
• 101′, 101″) via a contact with the housing (402);
• and
• wherein the negative high-voltage pole (109) is connected to ground via the at least one second capacitor (104) of the at least one capacitance module (101;
• 101′, 101″) via a contact with the housing (402).