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US 10,770,795 B2Granted
Antenna device and method for manufacturing antenna device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu
Life of this patent
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Abstract
An antenna device includes a package and at least one antenna. The package includes at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die. The antenna has at least one conductor at least partially in the molding compound and operatively connected to the RF die.
Claims20
An antenna device, comprising:
- a package comprising at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die;
- and
- at least one antenna comprising at least one conductor at least partially in the molding compound and operatively connected to the RF die, and comprising a director in the molding compound, wherein the at least one conductor has a bottom surface substantially coplanar with a bottom surface of the director, and the conductor comprises a first radiating element at least partially in the molding compound, the antenna comprises at least one first ground element, and the first radiating element is present between the first ground element and the director.
An antenna device, comprising:
- a package comprising at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die;
- at least one first dielectric layer over the RF die and the molding compound;
- at least one feeding line present in the first dielectric layer and electrically connected to the RF die;
- at least one ground element present in the first dielectric layer and having at least one aperture therein;
- at least one second dielectric layer over the ground element, wherein the second dielectric layer and the molding compound are made of different materials;
- and
- at least one radiating element present on the second dielectric layer, wherein the radiating element is operatively connected to the RF die.
4 more elements
A method for manufacturing an antenna device, the method comprising:
- forming an opening in a photo resist on a buffer layer;
- forming at least one radiating element in the opening of the photo resist and on the buffer layer;
- removing the photo resist;
- disposing at least one radio frequency (RF) die on the buffer layer;
- forming a molding compound that surrounds the RF die and the radiating element;
- forming a redistribution layer above the radiating element;
- forming a first dielectric layer and a ground element over the RF die and the molding compound, wherein the ground element is in the first dielectric layer;
- and
- forming a second dielectric layer over the ground element, wherein the second dielectric layer and the molding compound are made of different materials.
6 more elements
Dependencies are inferred from the claim text.