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US 10,770,626 B2Granted
Light-emitting dies incorporating wavelength-conversion materials and related methods
AssigneeEpistar Corporation
InventorsMichael A. Tischler, Alborz Amini, Thomas Pinnington, Henry Ip, Gianmarco Spiga
Life of this patent
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Abstract
In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
Claims13
An electronic device comprising:
- a plurality of light-emitting elements, each light-emitting element comprising a first bottom surface and a pair of contact pads disposed on the first bottom surface;
- a polymeric binder covering the plurality of light-emitting elements, exposing the pair of contact pads, and comprising a flat top surface and a second bottom surface;
- a plurality of contact layers connected to the pair of contact pads and the second bottom surface;
- an insulating layer disposed under the first bottom surface and connected to the plurality of contact layers;
- and
- a plurality of contacts disposed under the insulating layer and electrically connected to the plurality of contact layers.
3 more elements
Dependencies are inferred from the claim text.