Semiconductor device package, optical package, and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChang Chin Tsai, Chun-Han Chen, Hsin-Ying Ho
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Abstract
A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.
Claims20
A semiconductor package, comprising:
- a first substrate having a first surface;
- a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface connected to the first surface of the second substrate, a surface area of the first surface of the second substrate being less than a surface area of the second surface, and the first surface of the second substrate being disposed on the first surface of the first substrate;
- and
- a light source on the second surface of the second substrate.
An optical package structure, comprising:
- a substrate having a first surface;
- a light source on the first surface of the substrate, the light source having a light-emitting surface, a first surface opposite to the light-emitting surface, and a second surface between the light-emitting surface and the first surface, the first surface of the light source facing the first surface of the substrate, and
- a carrier between the light source and the substrate,
- wherein the light source comprises a first projection area on the first surface of the substrate and a second projection area on the carrier, wherein the first projection area is smaller than the second projection area.
A method of manufacturing an optical package structure, comprising:
- providing a substrate;
- providing an optical module, the optical module comprising:
- a carrier having a first surface and a second surface connected to the first surface, a surface area of the second surface being less than a surface area of the first surface;
- an edge emitting device on the first surface and electrically coupled to the carrier, the edge emitting device comprising a light emitting surface;
- and
- a protection element covering the edge emitting device and the carrier;
- forming a support structure over the substrate;
- and
- integrating the optical module with the substrate via the support structure, the light emitting surface being distal to the substrate.
Dependencies are inferred from the claim text.