Fingered capacitor with low-K and ultra-low-K dielectric layers
AssigneeNXP B.V.
InventorsChunshan Yin, Cheong Min Hong, Yu Chen
Life of this patent
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AssigneeNXP B.V.
InventorsChunshan Yin, Cheong Min Hong, Yu Chen
Estimating the term…
An integrated circuit having a fingered capacitor with multiple metal fingers formed in inverted-trapezoid-shaped trenches in a multi-layer structure having a polish stop layer over an ultra-low-K dielectric layer over a low-K dielectric layer over a dielectric cap layer. The ultra-low-K dielectric layer reduces capacitance variations between the fingers, while the polish stop layer prevents metal height variations that would otherwise result from performing CMP directly on the ultra-low-K dielectric layer. The layered structure may include another low-K dielectric layer over the polish stop layer that provides a soft landing for the CMP. The polish stop layer may be removed after the CMP polishing and another ultra-low-K dielectric layer may be formed to encapsulate the tops of the metal fingers in the ultra-low-K dielectric material.
An integrated circuit comprising a plurality of fingers forming a fingered capacitor, the fingered capacitor comprising:
An integrated circuit comprising a plurality of fingers forming a fingered capacitor, the fingered capacitor comprising:
An integrated circuit comprising a plurality of fingers forming a fingered capacitor, the fingered capacitor comprising:
Dependencies are inferred from the claim text.