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US 10,770,495 B1Granted
Solid-state imaging device, manufacturing method thereof, and camera with alternatively arranged pixel combinations
AssigneeSony Semiconductor Solutions Corporation
InventorsHiroaki Ishiwata, Sanghoon Ha
Life of this patent
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Abstract
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups, wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.
Claims30
An imaging device, comprising:
- a pixel array including a plurality of sub-arrays, each of the plurality of sub-arrays including four pixels arranged in 2×2 matrix, each of the four pixels including a photodiode and a transfer transistor;
- and
- a plurality of on-chip lenses, wherein
- each pixel of a first sub-array of the plurality of sub-arrays and a second sub-array of the plurality of sub-arrays includes a first color filter,
- each pixel of a third sub-array of the plurality of sub-arrays includes a second color filter,
- each pixel of a fourth sub-array of the plurality of sub-arrays includes a third color filter,
- the first sub-array is disposed diagonally to the second sub-array,
- the third sub-array is disposed diagonally to the fourth sub-array, and
- a first on-chip lens of the plurality of on-chip lenses is arranged at a light-incident side of at least a first pixel of the first sub-array, a second on-chip lens of the plurality of on-chip lenses is arranged at a light-incident side of at least a second pixel of the second sub-array, a third on-chip lens of the plurality of on-chip lenses is arranged at a light-incident side of at least a third pixel of the third sub-array and a fourth on-chip lens of the plurality of on-chip lenses is arranged at a light-incident side of at least a fourth pixel of the fourth sub-array.
6 more elements
A camera apparatus, comprising:
- an optical system;
- an imaging device, comprising:
- a pixel array including a plurality of sub-arrays, each of the plurality of sub-arrays including four pixels arranged in 2×2 matrix, each of the four pixels including a photodiode and a transfer transistor;
- and
- a plurality of on-chip lenses, wherein
- each pixel of a first sub-array of the plurality of sub-arrays and a second sub-array of the plurality of sub-arrays includes a first color filter,
- each pixel of a third sub-array of the plurality of sub-arrays includes a second color filter,
- each pixel of a fourth sub-array of the plurality of sub-arrays includes a third color filter,
- the first sub-array is disposed diagonally to the second sub-array,
- the third sub-array is disposed diagonally to the fourth sub-array, and
- a first on-chip lens of the plurality of on-chip lenses is arranged at a light-incident side of at least a first pixel of the first sub-array, a second on-chip lens of the plurality of on-chip lenses is arranged at a light-incident side of at least a second pixel of the second sub-array, a third on-chip lens of the plurality of on-chip lenses is arranged at a light-incident side of at least a third pixel of the third sub-array and a fourth on-chip lens of the plurality of on-chip lenses is arranged at a light-incident side of at least a fourth pixel of the fourth sub-array;
- and
- a signal processing circuitry.
10 more elements
Dependencies are inferred from the claim text.