Semiconductor packages and methods of manufacturing the same

A semiconductor package, comprising:

• a redistribution substrate;
• a semiconductor chip on the redistribution substrate;
• a conductive member spaced apart from the semiconductor chip on the redistribution substrate;
• a solder ball on the conductive member and electrically connected to the conductive member;
• and
• a polymer layer between the semiconductor chip and the conductive member on the redistribution substrate, the polymer layer having an opening through which the solder ball is exposed,
• wherein a bottom surface of the solder ball is disposed at a higher level than a bottom surface of the semiconductor chip,
• wherein the redistribution substrate comprises:
• a first insulation pattern on the bottom surface of the semiconductor chip, a bottom surface of the conductive member, and a lowermost surface of the polymer layer;
• and
• a redistribution member on a bottom surface of the first insulation pattern and having a melting point of more than that of the solder ball.

A semiconductor package, comprising:

• a substrate;
• a semiconductor chip on a center region of the substrate;
• a conductive member on an edge region of the substrate;
• a solder ball on the conductive member and electrically connected to the conductive member;
• a polymer layer between the semiconductor chip and the conductive member on the substrate, the polymer layer having an opening through which the solder ball is exposed;
• and residue polymer particles in the solder ball and including the same material as the polymer layer.