Electronics package having a multi-thickness conductor layer and method of manufacturing thereof

A method of manufacturing an electronics package comprising:

• forming a first portion of a multi-thickness conductor;
• forming a second portion of the multi-thickness conductor, the second portion thicker than the first portion;
• electrically coupling the first portion of the multi-thickness conductor to the second portion of the multi-thickness conductor through at least one via in an insulating substrate;
• affixing an active surface of a first electrical component to a first surface of the insulating substrate;
• electrically coupling the active surface of the first electrical component to the first portion of the multi-thickness conductor through at least another via in the insulating substrate;
• and
• affixing an active surface of a second electrical component to the second portion of the multi-thickness conductor.

An electronics package comprising:

• an insulating substrate;
• a first electrical component coupled to a first surface of the insulating substrate;
• a multi-thickness conductor comprising:
• a first conductor layer proximate the first surface of the insulating substrate;
• a second conductor layer proximate a second surface of the insulating substrate, opposite the first surface, the second conductor layer thinner than the first conductor layer;
• wherein the second conductor layer extends through at least one via in the insulating substrate to contact at least one contact pad on an active surface of the first electrical component;
• and
• wherein the second conductor layer extends through at least another via in the insulating substrate to contact the first conductor layer;
• and
• a second electrical component coupled to the first conductor layer.