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US 10,770,440 B2Granted
Micro-LED display assembly
AssigneeGlobalfoundries Inc.
InventorsLuke England, Bartlomiej Jan Pawlak
Life of this patent
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Abstract
The present disclosure relates to semiconductor structures and, more particularly, to a micro-light emitting diode (LED) display assembly and methods of manufacture. The structure includes an interposer and a plurality of micro-LED arrays each of which include a plurality of through-vias connecting pixels of the plurality of micro-LED arrays to the interposer.
Claims20
A structure, comprising:
- an interposer;
- a plurality of light emitting diode (LED) arrays each of which comprise a plurality of pixels composed of multiple sub-pixels;
- a plurality of through-vias composed of an insulator liner, diffusion barrier metal and electroplated metallization feature, each through via of the plurality of through-vias being directly below and connecting to each pixel of the plurality of pixels of each of the plurality of LED arrays by a metal pad that is in physical contact and directly below the each pixel, wherein each through via of the plurality of through vias is further connected to the interposer and a single through via is used per pixel;
- and
- a horizontal plate composed of GaN, wherein the plurality of pixels share the horizontal plate composed of GaN from above the plurality of pixels.
2 more elements
A structure comprising:
- an interposer comprising a plurality of through vias;
- a plurality of light emitting diode (LED) arrays each of which comprises a plurality of pixels, a plurality of through-vias composed of an insulator liner, a barrier metal and electroplated metallization feature and each one of the plurality of through vias being directly below and connecting a separate pixel of the plurality of pixels by a metal pad that is directly below and in physical contact with the separate pixel, and wherein each pixel of the plurality of pixels is composed of multiple sub-pixels;
- a back-end of the line wiring scheme which is positioned between and connected to the interposer and the plurality of LED arrays by a plurality of pillars, wherein each pillar of the plurality of pillars is aligned with and connects to the separate pixel of the plurality of pixels by a respective one of the plurality of through-vias such that only a single pillar the single pixel, respectively;
- and
- a horizontal plate composed of GaN, wherein the plurality of pixels share the horizontal plate composed of GaN from above the plurality of pixels.
2 more elements
Dependencies are inferred from the claim text.