High bandwidth die to die interconnect with package area reduction

A package structure comprising:

• a first wiring layer including a first side and a second side opposite the first side;
• a first die and a vertical interposer side-by-side on the first side of the first wiring layer, wherein the vertical interposer includes electrical interconnects from a first side of the vertical interposer coupled with the first side of the first wiring layer to a second side of the vertical interposer opposite the first side of the vertical interposer;
• a second die face down on and electrically connected with the second side of the vertical interposer;
• a local interposer on the second side of the first wiring layer and in electrical connection with the first die and the vertical interposer;
• a first molding compound encapsulating the first die, the vertical interposer, and the second die;
• and
• a second molding compound encapsulating the local interposer on the second side of the first wiring layer.

A method of forming a package structure comprising:

• placing a second die and mechanical chiplet on a carrier substrate;
• bonding a vertical interposer to the second die;
• placing a first die on the second die and the mechanical chiplet;
• encapsulating the second die, the mechanical chiplet, the vertical interposer, and the first die in a first molding compound;
• mounting a local interposer on and in electrical connection with the vertical interposer and the first die;
• and
• encapsulating the local interposer in a second molding compound.