Memory die layouts for failure protection in SSDs

A storage device, comprising:

• a first controller;
• a first memory device coupled to the first controller, the first memory device comprising non-volatile memory;
• and
• a second memory device coupled to the first controller, the second memory device comprising:
• a first package comprising an even number of first memory dies, wherein a first half of the first memory dies are disposed parallel to a second half of the first memory dies, and wherein each of the first memory dies have a first storage capacity;
• a second package disposed adjacent to the first package, the second package comprising a set of second memory dies, wherein a first memory die of the set of second memory dies is disposed adjacent to a second memory die of the set of second memory dies, and wherein each of the second memory dies have a second storage capacity less than the first storage capacity of the first memory dies;
• a first channel coupled to the first half of the first memory dies of the first package and to the first memory die of the set of the second package;
• and
• a second channel disposed parallel to the first channel, the second channel coupled to the second half of the first memory dies of the first package and to the second memory die of the set of the second package.

A storage device, comprising:

• a first memory device, comprising:
• a first package comprising an even number of first memory dies, wherein a first half of the first memory dies are disposed parallel to a second half of the first memory dies, and wherein each of the first memory dies have a first storage capacity;
• a second package disposed adjacent to the first package, the second package comprising a set of second memory dies, wherein a first memory die of the set of second memory dies is disposed adjacent to a second memory die of the set of second memory dies, and wherein each of the second memory dies have a second storage capacity less than the first storage capacity of the first memory dies;
• a first channel coupled to the first half of the first memory dies of the first package and to the first memory die of the set of the second package;
• a second channel disposed parallel to the first channel, the second channel coupled to the second half of first memory dies of the first package and to the second memory die of the set of the second package;
• a third package disposed adjacent to the first package, the third package comprising an even number of third memory dies, wherein a first half of the third memory dies are disposed parallel to a second half of the third memory dies, and wherein each of the third memory dies have a third storage capacity;
• a fourth package disposed adjacent to the third package and the second package, the fourth package comprising a set of fourth memory dies, wherein a first memory die of the set of fourth memory dies is disposed adjacent to a second memory die of the set of fourth memory dies, and wherein each of the fourth memory dies have a fourth storage capacity less than the third storage capacity less of the third memory dies;
• a third channel disposed parallel to the first channel and the second channel, the third channel coupled to the first half of the third memory dies of the third package and to the first memory die of the set of the fourth package;
• and
• a fourth channel disposed parallel to the third channel, the fourth channel coupled to the second half of third memory dies of the third package and to the second memory die of the set of the fourth package.