Micro device transferring method, and micro device substrate manufactured by micro device transferring method

A micro-device transfer method comprising:

• a compression step in which a carrier film having a micro-device attached to an adhesive layer thereof is brought into contact with a substrate comprising a solder deposited on metal electrodes formed on the substrate and is compressed on the substrate;
• a first adhesive strength generation step in which the solder disposed between the micro-device and the metal electrodes is compressed in the compression step to generate first adhesive strength between the micro-device and the solder;
• a second adhesive generation step in which the micro-device is bonded to the adhesive layer through press-fitting in the compression step to generate second adhesive strength between the micro-device and the adhesive layer;
• and
• a release step in which the carrier film is separated from the substrate, with the micro-device adhered to the solder,
• wherein the second adhesive strength is proportional to a press-fitting depth of the micro-device press-fitted into the adhesive layer and the press-fitting depth of the micro-device in the adhesive layer is determined within a range allowing the second adhesive strength to be less than the first adhesive strength.