Semiconductor structure and method of manufacturing thereof

A method of manufacturing a semiconductor structure comprising:

• forming a first component, wherein the first component comprises:
• a first dielectric layer;
• a first conductive structure in the first dielectric layer, wherein the first conductive structure comprises a first conductive line and a first conductive pad on the first conductive line;
• and
• a first filling material layer surrounding the first conductive pad and in contact with the first conductive line;
• forming a second component, wherein the second component comprises:
• a second dielectric layer;
• a second conductive structure in the second dielectric layer, wherein the second conductive structure comprises a second conductive line and a second conductive pad on the second conductive line;
• and
• a second filling material layer surrounding the second conductive pad and in contact with the second conductive line;
• and
• bonding the first component to the second component, wherein the first conductive pad is directly in contact with the second conductive pad, and the first dielectric layer is directly in contact with the second dielectric layer.