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US 10,770,423 B2Granted
Clamping system, wire bonding machine, and method for bonding wires
AssigneesSemiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
InventorQi Liu
Life of this patent
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Abstract
A clamping system, a wire bonding machine and a method for bonding wires are provided. An exemplary clamping system includes a clamping device. The clamping device includes: at least one linear guide rail; a first clamping rod arranged perpendicular to the linear guide rail; and a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod.
Claims21
A clamping system in a wire bonding machine, comprising:
- a clamping device including:
- at least one linear guide rail;
- a first clamping rod arranged perpendicular to the linear guide rail;
- a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod;
- and
- a plurality of card slots spaced apart from one another along a rail guiding direction on the linear guide rail, the plurality of card slots being capable of mounting one or more of the first clamping rod and the second clamping rod.
3 more elements
A wire bonding machine, comprising:
- a clamping device including:
- at least one linear guide rail;
- a first clamping rod arranged perpendicular to the linear guide rail;
- a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod;
- and
- a plurality of card slots spaced apart from one another along a rail guiding direction on the linear guide rail, the plurality of card slots being capable of mounting one or more of the first clamping rod and the second clamping rod.
3 more elements
Dependencies are inferred from the claim text.