Semiconductor device

A semiconductor device comprising:

• a lower electrode;
• an upper electrode provided above the lower electrode in a first direction;
• a semiconductor chip provided between the lower electrode and the upper electrode;
• a pressure pad provided between the lower electrode and the upper electrode to be overlapped with the semiconductor chip;
• and
• a spiral conductor provided between the lower electrode and the upper electrode to be overlapped with the semiconductor chip and the pressure pad, wherein
• the spiral conductor has an upper spiral conductor, and a lower spiral conductor which is in contact with a lower end of the upper spiral conductor and faces the upper spiral conductor,
• by forming grooves in the upper spiral conductor and the lower spiral conductor, a direction of a current flowing through the upper spiral conductor coincides with a direction of a current flowing through the lower spiral conductor in plan view, and
• in a view in a second direction substantially perpendicular to the first direction:
• one of the upper spiral conductor and the lower spiral conductor bends convex in the first direction, and
• the other of the upper spiral conductor and the lower spiral conductor bends convex in a third direction opposite to the first direction.