Packaged transistor devices with input-output isolation and methods of forming packaged transistor devices with input-output isolation

A packaged transistor device, comprising:

• a base;
• a transistor on the base, the transistor comprising a control terminal and an output terminal on opposite sides of the transistor;
• a first inductor connected to the control terminal, the first inductor comprising a first portion that extends at a first level that is farther from the base than a top surface of the transistor;
• a second inductor connected to the output terminal, the second inductor comprising a second portion that extends at a second level that is farther from the base than the top surface of the transistor;
• and
• an isolation material that is between the first portion and the second portion, wherein the isolation material is configured to reduce a coupling between the first inductor and the second inductor.

A method of manufacturing a packaged transistor device comprising:

• providing a transistor comprising a control terminal and an output terminal on opposite sides of the transistor;
• connecting a first bond wire to the control terminal;
• connecting a second bond wire to the output terminal;
• placing an isolation material on the transistor between the first bond wire and the second bond wire, wherein the isolation material is configured to reduce a coupling between the first bond wire and the second bond wire;
• and
• providing a package to enclose the transistor, the first bond wire, the second bond wire, and the isolation material.