Wiring board and semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorMasayuki Ogawa
Life of this patent
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Abstract
A wiring board includes an insulating layer, a plurality of pads formed on a surface of the insulating layer, and a chip mounting region defined on a surface of the wiring board formed with the plurality of pads. The plurality of pads are arranged in the chip mounting region. A cavity is formed in a surface of at least some of the plurality of pads. The cavity caves in, from the surface of the at least some of the plurality of pads, toward the insulating layer. The chip mounting region is segmented into a plurality of segmented regions, and a depth of the cavity is different for each of the plurality of segmented regions.
Claims12
A wiring board comprising:
- an insulating layer;
- a plurality of pads formed on a surface of the insulating layer;
- and
- a chip mounting region defined on a surface of the wiring board formed with the plurality of pads,
- wherein the plurality of pads are arranged in the chip mounting region,
- wherein a cavity is formed in a surface of at least some of the plurality of pads,
- wherein the cavity caves in, from the surface of the at least some of the plurality of pads, toward the insulating layer, and
- wherein the chip mounting region is segmented into a plurality of segmented regions, and a depth of the cavity is different for each of the plurality of segmented regions.
Dependencies are inferred from the claim text.