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US 10,770,403 B2Granted
Fan-out semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsMi Ja Han, Han Kim, Seong Chan Park
Life of this patent
Estimating the term…
Abstract
A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic radiation blocking layer disposed above the semiconductor chip and including a base layer in which a plurality of degassing holes are formed and a porous blocking portion filled in the plurality of degassing holes.
Claims16
A fan-out semiconductor package comprising:
- a connection member including an insulating layer and a redistribution layer;
- a semiconductor chip disposed on the connection member;
- an encapsulant encapsulating the semiconductor chip;
- and
- an electromagnetic radiation blocking layer disposed above the semiconductor chip and including a base layer in which a plurality of degassing holes are formed and a porous blocking portion filled in the plurality of degassing holes.
2 more elements
A fan-out semiconductor package comprising:
- a connection member including an insulating layer and a redistribution layer;
- a semiconductor chip disposed on the connection member;
- an encapsulant encapsulating the semiconductor chip;
- and
- an electromagnetic radiation blocking layer disposed above the semiconductor chip and having a porous structure.
2 more elements
Dependencies are inferred from the claim text.