Fan-out semiconductor packaging structure with antenna module and method making the same

A method for fabricating a fan-out semiconductor packaging structure with an antenna module, comprising the following steps:

• 1) providing a carrier and forming a peeling layer on a top surface of the carrier;
• 2) providing a semiconductor chip and mounting the semiconductor chip on a surface of the peeling layer with a front surface facing downward;
• 3) providing a filling structure on the surface of the peeling layer, wherein the filling structure is disposed at a periphery of the semiconductor chip;
• 4) forming a plastic packaging material layer on the surface of the peeling layer, wherein the plastic packaging material layer encloses the semiconductor chip and the filling structure;
• further planarizing the plastic packaging material layer to form a first surface and a second surface opposite to the first surface, wherein the first surface of the plastic packaging material layer, a top surface of the filling structure, and the front surface of the semiconductor chip are arranged in a same plane, and wherein the second surface of the plastic packaging material layer is in contact with the peeling layer;
• and wherein a material of the filling structure matches an antenna signal better than the plastic packaging material does such that a loss caused by the filling structures to the antenna signal is smaller than a loss caused by the plastic packaging material layer to the antenna signal;
• 5) removing the carrier and the peeling layer;
• 6) forming a redistribution layer on the second surface of the plastic packaging material layer, wherein the redistribution layer is electrically connected with the semiconductor chip;
• 7) forming an antenna module in direct contact with the top surface of the filling structure;
• and
• 8) forming a solder ball bump on a surface of the redistribution layer, wherein the solder ball bump is electrically connected with the redistribution layer.