Wiring board, electronic device, and wiring board manufacturing method

An electronic device comprising:

• a wiring board;
• and
• an electronic component that is mounted over the wiring board,
• the wiring board includes
• a first insulating layer including a first surface over which the electronic component is mounted, and a second surface opposite to the first surface,
• a conductive layer that is disposed on the second surface,
• a via that is disposed inside a first through-hole penetrating a portion between the first surface and the second surface of the insulating layer,
• an electrode that is disposed on the first surface and connected to the via, and
• a glass plate that is not in contact with the conductive layer or the electrode and is disposed on the first surface and includes a second through-hole through which the electrode is disposed.