Leadframe die pad with partially-etched groove between through-hole slots

An integrated circuit (IC) package, comprising:

• a semiconductor die having a top side with active circuitry and bond pads;
• a leadframe including a die pad having a die attach resin material including a resin mounting the semiconductor die top side up, the leadframe having leads or leads terminals beyond the die pad, the die pad comprising:
• slots including at least a first slot and a second slot on at least a first side of the die pad that penetrate a full thickness of the die pad;
• at least one non-penetrating groove in the die pad providing a fluid connection between the first and second slots for providing a flow channel for guiding the resin when received after bleeding out from under the semiconductor die to flow to at least one of the first and second slots;
• bond wires between some of the bond pads of the semiconductor die and the leads and lead terminals, and
• a mold compound covering the semiconductor die the bond wires and at least a portion of the leadframe.

A method of forming a packaged semiconductor device, comprising:

• providing a leadframe comprising a die pad for mounting a semiconductor die that has a top side with active circuitry and bond pads, the leadframe having leads or leads terminals beyond the die pad, the die pad comprising slots including a first slot and at least a second slot on at least a first side of the die pad that penetrate a full thickness of the die pad;
• at least one non-penetrating groove in the die pad providing a fluid connection including between the first and second slots for providing a flow channel for guiding the resin when received by the grooves after bleeding out from under the semiconductor die to flow to at least one of the first slot and the second slot;
• attaching the semiconductor die top side up on the die pad using a die attach resin material;
• placing bond wires between some of the bond pads of the semiconductor die and the leads and lead terminals and between at least one of the bond pads to a bonding site located between an outer edge of the semiconductor die and the groove and the slots;
• and
• covering the semiconductor die, the bond wires and at least a portion of the leadframe with a mold compound.