Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsYoichi Hironaka, Masuo Koga
Life of this patent
Estimating the term…
Abstract
A base plate (1) made of a metal has a through-hole (2). An insulating substrate (3) is provided on the base plate (1). A semiconductor chip (4) is provided on the insulating substrate (3). A case (8) has a screw-hole (9) communicating with the through-hole (2), covers the insulating substrate (3) and the semiconductor chip (4), and is disposed on the base plate (1). A screw (11) made of a metal is inserted into the through-hole (2) and the screw-hole (9) to fix the case (8) to the base plate (1). A flexible material (12) having flexibility is filled in a cavity between a bottom surface of the screw-hole (9) in the case (8) and a distal end of the screw (11).
Claims15
A semiconductor device comprising:
- a base plate made of a metal and having a through-hole;
- an insulating substrate on the base plate;
- a semiconductor chip on the insulating substrate;
- a case having a screw-hole formed only partially through the case, communicating with the through-hole, covering the insulating substrate and the semiconductor chip, and disposed on the base plate;
- a screw made of a metal and inserted into the through-hole and the screw-hole to fix the case to the base plate;
- and
- a flexible material having flexibility, compressed and filled in a cavity between a bottom surface of the screw-hole in the case and a distal end of the screw, wherein
- volume of the flexible material when it is uncompressed is larger than that of the cavity,
- an electrically conductive coat is applied to a side surface and the bottom surface of the screw-hole in the case, and
- the entire flexible material is composed of only a silicone rubber sponge or a fluorocarbon rubber sponge.
A semiconductor device comprising:
- a base plate made of a metal and having a through-hole;
- an insulating substrate on the base plate;
- a semiconductor chip on the insulating substrate;
- a case having a screw-hole, defined by sidewalls and a bottom, each formed by the case, the screw-hole communicating with the through-hole, covering the insulating substrate and the semiconductor chip, and disposed on the base plate;
- a screw made of a metal and inserted into the through-hole and the screw-hole to fix the case to the base plate;
- and
- a flexible material having flexibility, compressed and filled in a cavity between a bottom surface of the screw-hole in the case and a distal end of the screw, wherein
- volume of the flexible material when it is uncompressed is larger than that of the cavity,
- an electrically conductive coat is applied to the sidewalls and the bottom of the screw-hole in the case, and
- the entire flexible material is composed of only a silicone rubber sponge or a fluorocarbon rubber sponge.
A semiconductor device comprising:
- a base plate made of a metal and having a through-hole;
- an insulating substrate on the base plate;
- a semiconductor chip on the insulating substrate;
- a case having a screw-hole communicating with the through-hole, covering the insulating substrate and the semiconductor chip, and disposed on the base plate;
- a screw made of a metal and inserted into the through-hole and the screw-hole to fix the case to the base plate;
- and
- a flexible material having flexibility, compressed and filled in a cavity between a bottom surface of the screw-hole in the case and a distal end of the screw, wherein
- volume of the flexible material when it is uncompressed is larger than that of the cavity,
- an electrically conductive coat is applied to a side surface and the bottom surface of the screw-hole in the case, and
- the entire flexible material is composed of only a fluorocarbon rubber sponge.
Dependencies are inferred from the claim text.