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US 10,770,370 B2Granted
Electronic device and heat dissipating sheet
AssigneeFujitsu Limited
InventorsShinichi Hirose, Daiyu Kondo
Life of this patent
Estimating the term…
Abstract
An electronic device includes a component, a resin film formed to the component, and a plurality of carbon nanotubes whose end portions pass through the resin film and are in contact with the component, wherein a first portion of each of the carbon nanotubes is covered with the resin film, the first portion has a first length which is greater than a thickness of the resin film, and an intermediate portion of each of the carbon nanotubes other than the first portion is uncovered with and exposed from the resin.
Claims5
An electronic device comprising:
- a component;
- a resin film formed to the component;
- and
- a plurality of carbon nanotubes whose end portions pass through the resin film and are in contact with the component,
- wherein
- a first portion of each of the carbon nanotubes is covered with the resin film,
- the first portion has a first length which is greater than a thickness of the resin film, and
- an intermediate portion of each of the carbon nanotubes other than the first portion is uncovered with and exposed from the resin film.
5 more elements
A heat dissipating sheet comprising:
- a resin film formed to a component;
- and
- a plurality of carbon nanotubes whose end portions pass through the resin film and are in contact with the component,
- wherein
- a first portion of each of the carbon nanotubes is covered with the resin film,
- the first portion has a first length which is greater than a thickness of the resin film, and
- an intermediate portion of each of the carbon nanotubes other than the first portion is uncovered with and exposed from the resin film.
4 more elements
Dependencies are inferred from the claim text.