Semiconductor device package

A semiconductor device package, comprising:

• a substrate having a surface;
• a first electronic component and a second electronic component disposed over the surface of the substrate and arranged along a direction substantially parallel to the surface, wherein the first electronic component and the second electronic component are separated by a space therebetween;
• a heat dissipation lid disposed over the first electronic component and the second electronic component, wherein the heat dissipation lid defines one or more apertures at least over the space between the first electronic component and the second electronic component;
• and
• a thermal isolation disposed in the one or more apertures of the heat dissipation lid,
• wherein the one or more apertures includes a first aperture over the space between the first electronic component and the second electronic component, and one or more second apertures over at least one of the first electronic component or the second electronic component, and the first aperture is distinct from the one or more second apertures, wherein the first aperture partially overlaps an edge of the first electronic component and an edge of the second electronic component.