Chip on film package and heat-dissipation structure for a chip package

A chip on film package, comprising:

• a base film comprising a first surface and a second surface opposite to the first surface;
• a chip, disposed on the first surface of the base film, and comprising a top surface and a bottom surface connected to the first surface of the base film and opposite to the top surface;
• and
• a heat-dissipation structure comprising:
• a protection layer;
• a heat-dissipation layer;
• and
• a first adhesive layer disposed between an attaching surface of the protection layer and the heat-dissipation layer, wherein a contour line of the first adhesive layer does not exceed a contour line of the protection layer, wherein the heat dissipation structure is pressed to be attached to the base film during a process of attaching the heat dissipation structure.

A heat-dissipation structure for a chip package, comprising:

• a protection layer;
• a heat-dissipation layer;
• and
• a first adhesive layer disposed between an attaching surface of the protection layer and the heat-dissipation layer, wherein a protection distance maintains between the outmost contour line of the protection layer and the outmost contour line of the first adhesive layer,
• wherein the heat dissipation structure is configured to be pressed to be attached to a base substrate of the chip package during a process of attaching the heat dissipation structure.