Semiconductor apparatus, method for manufacturing the same and electric power conversion device
AssigneeMitsubishi Electric Corporation
InventorsTakuya Kitabayashi, Hiroshi Yoshida, Hidetoshi Ishibashi, Daisuke Murata
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Abstract
A semiconductor apparatus includes: a substrate including a circuit pattern on an upper surface side and a metal plate on a lower surface side; a semiconductor device joined to the circuit pattern via a conductive component; a case located to surround the substrate; a sealing material sealing the semiconductor device and the substrate in a section surrounded by the case; and a bonding agent bonding the case and the metal plate on a side face of the substrate.
Claims13
A semiconductor apparatus comprising:
- a substrate including an insulator disposed between a circuit pattern on an upper surface side and a metal plate on a lower surface side;
- a semiconductor device joined to the circuit pattern via a conductive component;
- a case located to surround the substrate, a gap being between the case and a lateral side face of the substrate;
- a sealing material sealing the semiconductor device and the substrate in a section surrounded by the case;
- and
- a bonding agent bonding the case and the metal plate on the lateral side face of the substrate, the bonding agent extending along a bottom surface of the case and filling the gap between the case and the lateral side face of the substrate.
A semiconductor apparatus comprising:
- a substrate including an insulator disposed between a circuit pattern on an upper surface side and a metal plate on a lower surface side;
- a semiconductor device joined to the circuit pattern via a conductive component;
- a case located to surround the substrate;
- a sealing material sealing the semiconductor device and the substrate in a section surrounded by the case;
- and
- a bonding agent bonding the case and the metal plate on a lateral side face of the substrate, the bonding agent covering a bottom surface of the case.
A semiconductor apparatus comprising:
- a substrate including an insulator disposed between a circuit pattern on an upper surface side and a metal plate on a lower surface side;
- a semiconductor device joined to the circuit pattern via a conductive component;
- a case located to surround the substrate;
- a sealing material sealing the semiconductor device and the substrate in a section surrounded by the case;
- and
- a bonding agent covering a lower inner part, a lower outer part, and a lower surface of the case, bonding the lower inner part of the case and a lateral side face of the metal plate on a lateral side face of the substrate.
Dependencies are inferred from the claim text.