Package structures and methods of forming the same

A package comprising:

• a first die bonded to a first side of a first interposer using first electrical connectors;
• a stack of memory dies bonded to the first side of the first interposer using second electrical connectors, the stack of memory dies being adjacent the first die, the stack of memory dies comprising a top die, the top die being the furthest die in the stack of memory dies from the first side of the first interposer, the top die having a thickness greater than a thickness of each of the other dies in the stack of memory dies;
• and
• a package substrate bonded to a second side of the first interposer, the second side being opposite the first side.

A structure comprising:

• active sides of a first die and a second die bonded to a first side of an interposer;
• a dummy die attached to the first side of the interposer, the dummy die being adjacent to at least one of first die or the second die;
• a cover structure attached to backsides of the dummy die, the second die, and the first die;
• and
• a package substrate bonded to a second side of the interposer, the second side being opposite the first side.