Semiconductor device and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Jing Lee, Tsung-Hsi Yang, Ming-Hua Yu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Jing Lee, Tsung-Hsi Yang, Ming-Hua Yu
Estimating the term…
An embodiment is a device including a first fin extending from a substrate, a first gate stack over and along sidewalls of the first fin, a first gate spacer disposed along a sidewall of the first gate stack, and a first epitaxial source/drain region in the first fin and adjacent the first gate spacer. The first epitaxial source/drain region including a first epitaxial layer on the first fin, the first epitaxial layer including silicon and carbon, a second epitaxial layer on the first epitaxial layer, the second epitaxial layer having a different material composition than the first epitaxial layer, the first epitaxial layer separating the second epitaxial layer from the first fin, and a third epitaxial layer on the second epitaxial layer, the third epitaxial layer having a different material composition than the first epitaxial layer.
A device comprising:
A device comprising:
A device comprising:
Dependencies are inferred from the claim text.