Semiconductor wafer device and manufacturing method thereof

A method for manufacturing a semiconductor device, comprising:

• providing a carrier;
• defining a plurality of die regions over the carrier along a first direction to arrange the plurality of die regions in a plurality of rows, wherein each of the plurality of rows has an edge die region having a corner contacting an edge of the carrier;
• shifting each of the plurality of rows along the first direction in a predetermined distance, wherein all of the die regions are within the carrier after the shifting of each of the plurality of rows, and each of the edge die region is entirely within the carrier after the shifting of each of the plurality of rows;
• and
• forming a die in each of the plurality of die regions.

A method for manufacturing a semiconductor device, comprising:

• providing a carrier;
• defining a plurality of die regions over the carrier along a first direction and a second direction to arrange the plurality of die regions in a plurality of rows and a plurality of columns, wherein each of the die regions has a first side parallel to the first direction and a second side parallel to the second direction,
• identifying a row when a shortest distance between an edge of the carrier and the second side of a die region disposed at an end of the row is larger than a half of a length of the first side;
• shifting the row along the first direction in a predetermined distance;
• disposing an additional die region at an end of the shifted row;
• and
• forming a die in each of the plurality of die regions and the additional die region, wherein the die regions are separated from each other by a plurality of first continuous lines extending along the first direction and a plurality of second continuous lines extending along the second direction before the identifying of the row, and the shifting of the row breaks the plurality of second continuous lines to form a plurality of discontinuous lines along the second direction.