EPI thickness tuning by pulse or profile spot heating
AssigneeApplied Materials, Inc.
InventorsShu-Kwan Danny Lau, Zhiyuan Ye, Zuoming Zhu, Nyi O. Myo, Errol Antonio C. Sanchez, Schubert S. Chu
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AssigneeApplied Materials, Inc.
InventorsShu-Kwan Danny Lau, Zhiyuan Ye, Zuoming Zhu, Nyi O. Myo, Errol Antonio C. Sanchez, Schubert S. Chu
Estimating the term…
Embodiments described herein provide processing chambers that include an enclosure for a processing volume, a rotatable support within the enclosure, the support having a shaft that extends outside the enclosure, wherein the shaft has a signal feature located outside the processing volume, an energy module within the enclosure, wherein the shaft extends through the energy module, one or more directed energy sources coupled to the enclosure, and one or more signalers positioned proximate to the signal feature, each signaler coupled to at least one of the directed energy sources.
A processing chamber, comprising:
A processing chamber, comprising:
A processing chamber, comprising:
Dependencies are inferred from the claim text.