Integrated fan-out package and manufacturing method thereof

An integrated fan-out package, comprising:

• a first redistribution structure, comprising:
• a first dielectric layer;
• a ground plane disposed on the first dielectric layer;
• a second dielectric layer disposed on the first dielectric layer, wherein the second dielectric layer covers the ground plane, and the second dielectric layer has a plurality of trenches;
• and
• a first feed line disposed on the first dielectric layer and located in the plurality of trenches;
• a die, disposed on the first redistribution structure;
• an insulation encapsulation encapsulating the die, wherein the insulation encapsulation fills into the plurality of trenches to cover the first feed line and sidewalls of the plurality of trenches, and the insulation encapsulation has a lower dissipation factor (Df) and/or a lower permittivity (Dk) than the first dielectric layer;
• and
• a second redistribution structure disposed on the die and the insulation encapsulation.

A manufacturing method of an integrated fan-out package, comprising:

• forming a first redistribution structure, comprising:
• forming a first dielectric layer;
• and
• forming a first feed line on the first dielectric layer;
• placing a die on the first redistribution structure, wherein the die has an active surface and a rear surface opposite to the active surface, and the rear surface of the die is attached to the first redistribution structure;
• forming an insulation encapsulation on the first redistribution structure to encapsulate the die, wherein the insulation encapsulation has a protrusion laterally wraps around the feed line, and the insulation encapsulation has a lower dissipation factor (DO and/or a lower permittivity (Dk) than the dielectric layer;
• and
• forming a second redistribution structure on the die and the insulation encapsulation.