US 10,770,301 B2Granted

Planarization processing device

AssigneeToho Engineering Kabushiki Kaisha

InventorsTatsutoshi Suzuki, Eisuke Suzuki, Daisuke Suzuki

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Abstract

A planarization processing device for polishing a substrate, e.g., a semiconductor wafer, includes two planarization processing sections (SP1, SP2) that each include a holder (62) for holding a workpiece (W), a drive motor (71) that rotates the holder (62), a support plate (4) holds a pad (5), a linear guide (3) that guides reciprocal movement of the support plate (4) in a direction parallel to the surface of the pad (5), and a drive cylinder (72) that advances the holder (62) or the support plate (4) in a direction that intersects the surface of the workpiece W or the pad (5) to cause the opposing surfaces of the workpiece and the pad (5) to be at least proximal to each other. A primary driver (PD) causes the support plates (4) of the planarization processing sections (SP1, SP2) to reciprocate along the same straight line in opposite phases.

Claims21

Dependent claims

A planarization processing system comprising:

a first planarization processing unit that includes:
a first holding means that holds one of a workpiece and a catalyst body having a catalyst layer at least on a surface thereof, and
a second holding means that holds the other of the workpiece and the catalyst body and brings the surface thereof into contact with or proximal to a surface of the one of the workpiece and the catalyst body;
a first guide, along which the second holding means is movable in a direction parallel to the other surface of the workpiece or the catalyst body at least by an amount that makes possible planarization based on a catalytic reaction;
a primary driver that moves the second holding means along the first guide to planarize the workpiece;
and
a counterweight operably connected to the primary driver and movable by the primary driver in a manner that counteracts reaction forces produced by the movement of the second holding means in such a way that vibrations caused by the movement of the second holding means are attenuated.

4 more elements

A wafer planarizing system comprising:

a first planarization processing unit that includes:
a first holder configured to hold one of a wafer and a pad having a catalyst layer, and
a second holder configured to hold the other of the wafer and the pad,
a first guide configured to support non-rotational movement of the second holder in a direction parallel to contacting surface of the wafer and pad at least by an amount that makes possible planarization based on a catalytic reaction;
a counterweight having at least substantially the same weight as the first planarization processing unit;
and
a primary driver configured to move the second holder and the counterweight such that reaction forces caused by movement of the second holder are at least substantially cancelled by opposite reaction forces caused by movement of the counterweight.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/751,699Filed 10 Mar 2017
Priority: JP 2016-04810811 Mar 2016
Published: US 2018/0277380 A127 Sep 2018
Granted: 8 Sep 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10P 52/402
Chemomechanical polishing [CMP]: of semiconductor materials
B24B 1/00
Processes of grinding or polishing
B24B 1/04
Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes: subjecting the grinding or polishing tools, the…
B24B 37/07
Designed for working plane surfaces: characterised by the movement of the work or lapping tool

Family

US 2018/0277380 A1Pre-grant publication · published 27 Sep 2018
US 10,770,301 B2This patent

From the US filing history. Foreign family members aren’t listed.

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