Automatic inspection device and method of laser processing equipment

An automatic inspection method for inspecting processing quality of laser processing equipment that forms a modified area by irradiating a laser beam into an object to be processed, the automatic inspection method comprising:

• preparing the object to be processed on which an image film is coated;
• performing a processing operation by irradiating the laser beam into the object to be processed by using the laser processing equipment;
• detecting a damage image of the object to be processed formed on the image film through irradiation of the laser beam;
• and
• processing the damage image of the object to be processed,
• wherein the damage image of the object to be processed is processed by an image processing unit, and
• wherein the processing of the damage image of the object to be processed comprises:
• converting the damage image of the object to be processed detected by the image sensing unit into a binary image;
• removing a processing line image from the binary image;
• and
• extracting position information of damage points indicating points at which the object to be processed is damaged from the binary image from which the processing line image is removed.

A semiconductor processing method for laser processing equipment, the method comprising:

• preparing the object to be processed on which an image film is coated;
• performing a processing operation by irradiating the laser beam into one side of the object to be processed to form a modified area therein by using the laser processing equipment;
• detecting an image of damage to an opposing side surface of the object to be processed, the image formed on the image film by the irradiation of the laser beam;
• and
• processing the image of damage to the object to be processed.