Film forming unit for sputtering apparatus

A film forming unit for a sputtering apparatus comprising:

• a supporting plate detachably disposed on an opening in a vacuum chamber, provided that one-side surface of the supporting plate is defined as an upper side, the supporting plate having on the upper side thereof;
• at least one target, each target having a backing plate bonded to a lower surface of the target;
• a magnet unit fixedly disposed between the backing plate and the supporting plate so as to cause leakage magnetic field to function on the target;
• and
• driving means for reciprocating the target relative to the magnet unit along the supporting plate while electric power is applied from a sputtering power source to the target, thereby sputtering the target,
• wherein:
• each backing plate has a supply pipe and a discharge pipe for coolant,
• the supply pipe and discharge pipe protrude into the backing plate for communication with coolant passages formed inside the backing plate;
• the supporting plate has a slit hole which is elongated in the direction of reciprocating movement of the target and through which the supply pipe and the discharge pipe, both for coolant, are respectively inserted;
• the supporting plate has on its lower surface a cap body which hermetically encloses, inclusive of the slit hole, those portions of the supply pipe and the discharge pipe which are protruded downward from the slit hole;
• bellows pipes are respectively inserted onto an outside of those portions of the supply pipe and discharge pipe which are protruded in the reciprocating direction out of the cap body;
• and
• a drive part of the driving means is coupled to at least one of the supply pipe and the discharge pipe.