Copper alloy sputtering target and manufacturing method of copper alloy sputtering target

A manufacturing method of a copper alloy sputtering target, the sputtering target formed by a copper alloy containing:

• the content of Ca being 0.3 to 1.7% by mass;
• the total content of Mg and Al being 5 ppm or less by mass;
• the content of oxygen being 20 ppm or less by mass;
• and the remainder is Cu and inevitable impurities, with Fe, Mn and Si being contained as the inevitable impurities in the copper alloy sputtering target, and the content of Fe is 1 ppm or less by mass, the content of Mn is 1 ppm or less by mass, and the content of Si is 1 ppm or less by mass, the manufacturing method comprising the steps of:
• preparing a copper having purity of 99.99% or more by mass;
• melting the copper by a high frequency induction heating in a crucible in an inert gas atmosphere or a reducing gas atmosphere so as to obtain a molten copper;
• controlling component so as to obtain a molten metal having a predetermined component compositions by the addition of Ca having purity of 98.5% or more by mass into the molten copper and by melting the Ca;
• casting the molten metal having the predetermined component compositions in a cooled casting mold so as to obtain an ingot;
• and
• performing stress relieving annealing after performing hot-rolling to the ingot,
• and wherein the copper alloy sputtering target causes no abnormal discharge when sputtering for 8 hours at an output of 600 W by using direct current system as a power supply,
• wherein the abnormal discharge is counted using an arc counter provided in the power supply, and
• wherein the sputtering is performed under conditions of evacuating a vacuum chamber of a sputtering apparatus to a vacuum pressure of 4×10−5 Pa or less, and then supplying an oxygen-Ar mixed gas including pure Ar gas or oxygen in a proportion of 10% by volume into the vacuum chamber as a sputtering gas to set a pressure of a sputtering atmosphere to 0.67 Pa.

A manufacturing method of a copper alloy sputtering target, the sputtering target being the copper alloy sputtering target, the manufacturing method comprising the steps of:

• preparing a copper having purity of 99.99% or more by mass;
• melting the copper by a high frequency induction heating in a crucible in an inert gas atmosphere or a reducing gas atmosphere so as to obtain a molten copper;
• controlling component so as to obtain a molten metal having a predetermined component compositions by the addition of Ca having purity of 98.5% or more by mass into the molten copper and by melting the Ca;
• casting the molten metal having the predetermined component compositions in a cooled casting mold so as to obtain an ingot;
• and
• performing stress relieving annealing after performing hot-rolling to the ingot,
• and wherein the copper alloy sputtering target causes no abnormal discharge when sputtering for 8 hours at an output of 600 W by using direct current system as a power supply,
• wherein the abnormal discharge is counted using an arc counter provided in the power supply, and
• wherein the sputtering is performed under conditions of evacuating a vacuum chamber of a sputtering apparatus to a vacuum pressure of 4×10−5 Pa or less, and then supplying an oxygen-Ar mixed gas including pure Ar gas or oxygen in a proportion of 10% by volume into the vacuum chamber as a sputtering gas to set a pressure of a sputtering atmosphere to 0.67 Pa.