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AssigneeApplied Materials, Inc.
InventorsJaeyong Cho, Haitao Wang, Vijay D. Parkhe, Kartik Ramaswamy, Chunlei Zhang
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An electrostatic chuck is described to carry a workpiece for processing such as high power plasma processing. In embodiments, the chuck includes a top plate to carry the workpiece, the top plate having an electrode to grip the workpiece, a cooling plate under the top plate to cool the top plate, a gas hole through the cooling plate and the top plate to feed a gas to the workpiece through the top plate, and an aperture-reducing plug in the cooling plate gas hole to conduct gas flow through the hole.
An electrostatic chuck to carry a workpiece for processing, the electrostatic chuck comprising:
A method for processing a workpiece using an electrostatic chuck with a top plate and a cooling plate, the method comprising conducting a cooling gas from the cooling plate into a plug in the top plate and through a gas hole in the top plate to the back side of the workpiece, the plug having a top surface and a tapered shape, the top surface facing away from the cooling plate, and the tapered shape inwardly tapering in a direction from the cooling plate to the top plate, wherein the gas hole extends from the top surface of the plug through the top plate, and the conducting including conducting the cooling gas through an aperture-reducing plug in the cooling plate.
A plasma processing chamber comprising:
Dependencies are inferred from the claim text.