Back to results
US 10,770,206 B1Granted
System and method for fabricating a strain sensing device directly on a structure
OwnerRoberto S. Aga, Emily M. Heckmaninventors
Life of this patent
Estimating the term…
Abstract
Various deficiencies in the prior art are addressed by systems, methods, architectures, mechanisms and/or apparatus configured for fabricating a strain sensing device directly on a structure by printing a material on the structure, the material exhibiting a piezo-resistive effect, and sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive.
Claims23
A method for fabricating a strain sensing device directly on a structure, the method comprising:
- printing a material on the structure, the material exhibiting a piezo-resistive effect;
- sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive;
- and
- attaching a pin connector to the electrically conductive strain sensing pattern.
1 more element
A method for fabricating a strain sensing device directly on a structure, the method comprising:
- printing a first material on the structure, the first material exhibiting a piezo-resistive effect;
- sintering a first strain sensing pattern from the first material such that the first strain sensing pattern becomes electrically conductive;
- printing an insulating layer on the first material;
- printing a second material on the insulating layer, the second material exhibiting a piezo-resistive effect;
- and
- sintering a second strain sensing pattern from the second material such that the second strain sensing pattern become electrically conductive.
3 more elements
Dependencies are inferred from the claim text.