Method for manufacturing electronic component

A method for manufacturing an electronic component comprising the steps of:

• preparing an element assembly in which inner electrodes are embedded and including a pair of main surfaces, a pair of side surfaces respectively connecting the main surfaces, and a pair of end surfaces respectively perpendicular or substantially perpendicular to the pair of main surfaces and the pair of side surfaces;
• and
• providing an outer electrode on the element assembly so that the outer electrode is electrically connected with the inner electrodes;
• wherein
• the step of providing the outer electrode includes a step of providing a sintered layer including a sintered metal, a step of providing an insulation layer including an electric insulation material, and a step of providing a Sn-containing layer including Sn;
• in the step of providing the sintered layer, the sintered layer extends from each of the pair of end surfaces onto at least one of the pair of main surfaces so as to cover each of the pair of end surfaces;
• in the step of providing the insulation layer, the insulation layer is directly provided on the sintered layer at each of the pair of end surfaces to extend in a direction perpendicular or substantially perpendicular to the pair of side surfaces so as to constitute a portion of a surface of the outer electrode;
• and
• in the step of providing the Sn-containing layer, the Sn-containing layer is provided to cover the sintered layer except for a portion of the sintered layer that is covered by the insulation layer so as to constitute another portion of the surface of the outer electrode, and the Sn-containing layer covers a portion of the sintered layer on at least a portion of one of the pair of main surfaces and a portion of one of the pair of side surfaces of the element assembly.