Data storage device, operating method of the same, and electronic system including the same

A data storage device, comprising:

• a controller mounted on a substrate, the controller including a central processing unit (CPU), an internal memory, a buffer memory control unit, and a flash interface;
• and
• a buffer memory;
• and
• a plurality of memory packages including M channels, where M is a natural number of 1 to 16, and each of the M channels includes N ways, where N is a natural number of 2 to 128 and each of the plurality of memory packages includes at least one semiconductor die and is configured to transmit and receive data to and from the controller through one of the M channels,
• wherein each of the M channels includes P memory packages (where P is a natural number of 2 to 64), and the controller is configured such that a numbers of ways respectively corresponding to the P memory packages are equal to each other when a write operation of data is performed through one channel, and
• wherein, when a write operation transfer condition is satisfied, a next write operation is transferred to another semiconductor die in a same channel, and when a package switching condition is satisfied, the next write operation is transferred to another memory package in the same channel.

A solid state drive (SSD) comprising:

• a plurality of memory packages, each of the memory packages having at least one semiconductor die;
• a buffer memory;
• and
• a controller including a central processing unit (CPU), an internal memory, a buffer memory control unit, and a flash interface;
• wherein the plurality of memory packages being configured to be controlled by the controller and to transmit and receive data to and from the controller via M channels (where M is a natural number of 1 to 16), each of which comprises N ways (where N is a natural number of 2 to 128 and is equal for each of the M channels),
• wherein semiconductor dies belonging to one channel are each configured such that a write operation is transferred from one semiconductor die using one way of the N ways to another semiconductor die using another way of the N ways in the one channel when a write operation transfer condition is satisfied,
• wherein transfers of the write operation are sequentially performed on the semiconductor dies belonging to the one channel,
• wherein the N ways are sequentially used until each of them is used once, and
• wherein a number of memory packages is equal for each of the M channels.