Electronic device including optical image sensor having metallization layers and related methods
AssigneeApple Inc.
InventorsMohammad Yeke Yazdandoost, Giovanni Gozzini
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Abstract
An electronic device may include an optical image sensor that includes optical image sensing circuitry and metallization layers above the optical image sensing circuitry. Each layer may have at least one light transmissive collimation opening therein aligned with the optical image sensing circuitry. The electronic device may also include a light source layer above the optical image sensor and a transparent cover layer above the light source layer defining a finger placement surface configured to receive a finger adjacent thereto.
Claims17
An electronic device comprising:
- an optical image sensor comprising
- optical image sensing circuitry, and
- a collimation layer comprising
- a plurality of metallization layers above the optical image sensing circuitry, each layer having at least one light transmissive collimation opening therein aligned with the optical image sensing circuitry, and
- a plurality of inter-level dielectric layers respectively carrying each of the plurality of metallization layers;
- a light source layer adjacent the optical image sensor;
- and
- a transparent cover layer above the light source layer defining a finger placement surface configured to receive a finger adjacent thereto.
An electronic device comprising:
- an optical image sensor comprising
- optical image sensing circuitry comprising an array of photodiodes and a readout circuitry coupled thereto, and
- a collimation layer comprising
- a plurality of metallization layers above the optical image sensing circuitry, each layer having at least one light transmissive collimation opening therein aligned with the optical image sensing circuitry, the plurality of light transmissive collimation openings having a cylindrical shape, and
- a plurality of inter-level dielectric layers respectively carrying each of the plurality of metallization layers;
- a light source layer adjacent the optical image sensor;
- and
- a transparent cover layer above the light source layer defining a finger placement surface configured to receive a finger adjacent thereto.
A method for making an electronic device comprising:
- forming an optical image sensor comprising optical image sensing circuitry, and a collimation layer, the collimation layer comprising a plurality of metallization layers above the optical image sensing circuitry, each metallization layer formed to have at least one light transmissive collimation opening therein aligned with the optical image sensing circuitry, and a plurality of inter-level dielectric layers, each inter-level dielectric layer formed to carry a respective one of the plurality of metallization layers;
- positioning a light source layer adjacent the optical image sensor;
- and
- positioning a transparent cover layer above the light source layer to define a finger placement surface configured to receive a finger adjacent thereto.
Dependencies are inferred from the claim text.