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US 10,768,534 B2Granted
Photolithography apparatus and method and method for handling wafer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Ming Shih, Chi-Hung Liao
Life of this patent
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Abstract
A method for adhering a reticle onto a top surface of a chuck is provided in accordance with some embodiments of the present disclosure. The method includes contacting a plurality of fibers on the top surface of the chuck with the reticle. The reticle is slid relative to the top surface of the chuck along a first direction to increase a contact area between the fibers and the reticle, such that the reticle is adhered to the fibers.
Claims20
A method, comprising:
- contacting a plurality of fibers on a top surface of a chuck with a reticle;
- and
- sliding the reticle relative to the top surface of the chuck along a first direction to increase a contact area between the fibers and the reticle, such that the reticle is adhered to the fibers.
A method, comprising:
- contacting a plurality of fibers on a top surface of a wafer holder with a wafer;
- and
- sliding the wafer holder relative to the wafer along a first direction to incline the fibers relative to the top surface of the wafer holder, such that the wafer is adhered to the fibers.
An apparatus, comprising:
- a workpiece holding device;
- and
- a plurality of bendable fibers on a top surface of the workpiece holding device,
- wherein each of the bendable fibers extends away from the top surface of the workpiece holding device and is distant from one to the other.
1 more element
Dependencies are inferred from the claim text.