Pellicle for EUV lithography and method of fabricating the same

A method of fabricating a pellicle for extreme ultraviolet lithography, the method comprising:

• a) preparing a substrate, which comprises a support layer comprising silicon (Si), a buried oxide layer provided on the support layer, and a pellicle layer provided on the buried oxide layer and comprising silicon (Si);
• b) forming a reinforcement layer on both sides of the substrate;
• c) forming a reinforcement layer pattern, through which the support layer is partially exposed, by patterning the reinforcement layer formed in the support layer;
• d) forming a support layer pattern, through which the buried oxide layer is exposed, by etching the support layer using the reinforcement layer etched in c) as an etching mask;
• e) exposing the pellicle layer by etching the buried oxide layer using the reinforcement layer pattern and the support layer pattern as an etching mask;
• and f) forming a heat dissipation layer provided on an upper side, a lower side or both sides of the pellicle layer.

A method of fabricating a pellicle for extreme ultraviolet lithography, the method comprising:

• a) preparing a substrate, which comprises a support layer comprising silicon (Si), a buried oxide layer provided on the support layer, a buried reinforcement layer provided on the buried oxide layer, and a pellicle layer provided on the buried reinforcement layer and comprising silicon (Si);
• b) forming a reinforcement layer on both sides of the substrate;
• c) forming a reinforcement layer pattern, through which the support layer is partially exposed, by patterning the reinforcement layer formed in the support layer;
• d) forming a support layer pattern, through which the buried oxide layer is exposed, by etching the support layer using the reinforcement layer etched in c) as an etching mask;
• e) exposing the buried reinforcement layer by etching the buried oxide layer using the reinforcement layer pattern and the support layer pattern as an etching mask;
• f) forming a heat dissipation layer provided on an upper side, a lower side or both sides of the pellicle layer.