Thermal conductivity measurement apparatus and thermal conductivity measurement method
AssigneeMitsubishi Electric Corporation
InventorsYasuyuki Sanda, Dai Nakajima, Haruna Tada
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AssigneeMitsubishi Electric Corporation
InventorsYasuyuki Sanda, Dai Nakajima, Haruna Tada
Estimating the term…
This thermal conductivity measurement apparatus has a first holding member which has an end face that contacts an object to be measured and a distal end face; a second holding member which has an end face that contacts an object to be measured and a distal end face; a heating member which has an end face which abuts the distal end face of the first holding member and a distal end face, and which heats the first holding member; a cooling member which has an end face that abuts the distal end face of the second holding member and a distal end face, and which cools the second holding member; a plurality of temperature sensors provided at the first and the second holding members; and a pressing force application mechanism that applies pressing force to the first holding member, the second holding member, and the object to be measured.
A thermal conductivity measurement apparatus comprising:
A thermal conductivity measurement apparatus comprising:
Dependencies are inferred from the claim text.