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US 10,767,833 B2Granted
Optical device, method for manufacturing same, and display device
AssigneesHefei Boe Optoelectronics Technology Co., Ltd., Boe Technology Group Co., Ltd.
InventorsBing Zhang, Xiaolin Geng, Liang Gao, Jianwei Qin, Hai Tang, Lu Gao, Jingbin Jie, Bo Han
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Abstract
Provided is an optical device, a method for manufacturing the same, and a display device. The optical device includes a chip substrate and a quantum dot film. The quantum dot film includes a quantum dot functional layer, a first package substrate, a second package substrate, and a prism structure and/or a uniform-light diffusing film.
Claims20
An optical device, comprising:
- a chip substrate having a first face on which a plurality of light-emitting chips for emitting blue light is distributed in an array;
- and
- a quantum dot film arranged on a side of the chip substrate where the first face is located and configured to convert the blue light emitted by the plurality of light-emitting chips into monochromatic light in various colors capable of being mixed into white light,
- wherein the quantum dot film comprises:
- a quantum dot functional layer,
- a first package substrate arranged on a side of the quantum dot functional layer away from the chip substrate and comprising a first side surface away from the quantum dot functional layer and a second side surface arranged opposite to the first side surface, and
- a second package substrate arranged on a side of the quantum dot functional layer proximate to the chip substrate, and comprising a third side surface away from the quantum dot functional layer and a fourth side surface arranged opposite to the third side surface, and
- wherein the quantum dot film further comprises:
- a prism structure integrated on the first side surface of the first package substrate with the first package substrate as a base substrate;
- and
- a uniform-light diffusing film integrated on the third side surface of the second package substrate with the second package substrate as a base substrate.
8 more elements
A method for manufacturing an optical device, comprising:
- providing a first package substrate comprising a first side surface and a second side surface arranged opposite to each other and a second package substrate comprising a third side surface and a fourth side surface disposed opposite to each other;
- bonding the second side surface of the first package substrate and the fourth side surface of the second package substrate by applying a quantum dot functional layer between the first package substrate and the second package substrate to form a quantum dot film after the quantum dot functional layer has been cured;
- forming a chip substrate having a first face on which a plurality of light-emitting chips for emitting blue light is distributed in an array;
- and
- arranging the quantum dot film on a side of the chip substrate where the first face is located,
- wherein the providing the first package substrate and the second package substrate comprises:
- forming a prism structure on the first side surface of the first package substrate with the first package substrate as a base substrate, and
- forming a uniform-light diffusing film on the third side surface of the second package substrate with the second package substrate as a base substrate.
5 more elements
Dependencies are inferred from the claim text.