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US 10,767,040 B2Granted
Thermosetting epoxy resin compositions useful as structural reinforcement or structural foam
AssigneeSika Technology AG
InventorJohn Hanley
Life of this patent
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Abstract
Thermosetting epoxy resin compositions on the one hand at room temperature in the incompletely cured state exhibit extremely slight alteration in shape and on the other hand develop a high surface tack, and, moreover, in the fully cured state are of high impact strength and at the same time exhibits high adhesion, particularly to metallic substrates. These compositions are ideally suited to the production of self-adhesive reinforcing elements.
Claims20
A thermosetting epoxy resin composition comprising
- from 17.5 to 30 weight % of at least one liquid epoxy resin A having on average more than one epoxide group per molecule;
- from 1 to 5 weight % of at least one hardener B for epoxy resins which is activated by elevated temperature;
- from 0 to 2 weight % of at least one accelerator C;
- from 5 to 12 weight %, of at least one polymeric impact modifier D, which is a terminally blocked polyurethane prepolymer;
- from 1 to 5 weight % of at least one polyisoprene E;
- from 5 to 10 weight % of at least one carboxyl- or epoxide- terminated acrylonitrile/butadiene copolymer F which is liquid at room temperature;
- from 15 to 20 weight % of at least one carboxyl- or epoxide- terminated acrylonitrile/butadiene copolymer G which is solid at room temperature;
- based on a total weight of the epoxy resin composition.
5 more elements
Dependencies are inferred from the claim text.