Resin composition, method for producing resin composition, film formation method, and cured product

A resin composition comprising a silicon-containing resin component and a solvent, wherein

• the silicon-containing resin component comprises (II) a mixture of a resin having a polysilane structure (II-1) and a resin having a polysiloxane structure (II-2), and
• the solvent comprises a terpene compound having at least one group selected from the group consisting of a hydroxy group and an acetoxy group,
• wherein the polysiloxane structures (II-2) comprises a hydrolyzed and condensed structure of at least one silicon compound selected from the group consisting of silicon compounds represented by the following general formulas (A-1-1) to (A-1-4):
• R1R2R3SiX1 (A-1-1)
• R4R5SiX22 (A-1-2)
• R6SiX33 (A-1-3)
• SiX44 (A-1-4)
• wherein X1 to X4 are each independently a hydrolyzable group, and wherein R1, R2, R3, R4, R5, and R6 are each independently a hydrogen atom or an organic group, and hydrogen atoms in the organic group may be substituted with a halogen atom, and
• wherein the polysilane structure (II-1) comprises a structure corresponding to at least one selected from the group consisting of polysilane compounds represented by the following general formulas (A-2-1) and (A-2-2):
• (R7R8R9Si)a1(R10R11Si)a2(R12Si)a3(Si)a4 (A-2-1)
• wherein R7, R8, R9, R10, R11, and R12 are each independently a hydrogen atom, a hydroxyl group, or a monovalent organic group, Si atoms do not bond to each other via R7, R8, R9, R10, R11 or R12, but form an Si—Si bond, and a1, a2, a3, and a4 are each independently a molar fraction, a1+a2+a3+a4=1, 0≤a1≤1, 0≤a2≤1, 0≤a3≤1, and 0≤a4≤1,
• wherein Ra1 and Ra2 each independently represents a hydrogen atom, a hydroxyl group, or an organic group, and n represents an integer of 5 to 20.