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US 10,766,768 B2Granted
Encapsulated microelectromechanical structure
AssigneeSiTime Corporation
InventorsAaron Partridge, Markus Lutz, Pavan Gupta
Life of this patent
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Abstract
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.
Claims20
An integrated circuit device comprising:
- a resonant microelectromechanical system (MEMS) structure supported by a first substrate, wherein the resonant MEMS structure comprises a silicon material doped with phosphorus;
- a second substrate mounted to the first substrate so as to enclose the resonant MEMS structure within a chamber defined between interior surfaces respective to the first substrate and the second substrate;
- an electrical contact formed in an exterior surface of one of the first substrate or the second substrate, the electrical contact to provide an output signal representing a resonance frequency of the resonant MEMS structure;
- and
- oscillator circuitry to generate a clock signal from the output signal.
2 more elements
A method of fabricating an integrated circuit device, the method comprising:
- forming a resonant microelectromechanical system (MEMS) structure from a silicon material, in a manner such that the resonant MEMS structure is doped with phosphorus, and in a manner such that the resonant MEMS structure is supported by a first substrate;
- mounting a second substrate to the first substrate so as to enclose the resonant MEMS structure within a chamber defined between interior surfaces respective to the first substrate and the second substrate;
- forming an electrical contact formed in an exterior surface of one of the first substrate or the second substrate, the electrical contact to provide an output signal representing a resonance frequency of the resonant MEMS structure;
- and
- providing oscillator circuitry, the oscillator circuitry to generate a clock signal from the output signal during operation of said integrated circuit device.
2 more elements
Dependencies are inferred from the claim text.