Thermoformable multilayer films and blister packs produced therefrom

A thermoformed blister package comprising:

• a multi-layer film structure, the multi-layer film structure including,
• a first polymeric layer having a first surface and a second surface, the first polymeric layer including,
• a metalized polyethylene terephthalate,
• a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer adjacent the second surface of the first polymeric layer, the second polymeric layer including,
• a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and
• a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer adjacent the second surface of the second polymeric layer, the third polymeric layer including,
• polypropylene or polyvinyl chloride,
• wherein the multi-layer film structure is thermoformed to define a plurality of domed receptacle portions;
• a flat film including a metallic foil, the flat film covering cavities defined by the plurality of domed receptacle portions, and a flat surface of the flat film extending over each of the cavities defined by the plurality of domed receptacle portions;
• and
• a lid-stock film arranged between the flat film and the multi-layer film structure, the lid-stock film configured to provide support.